EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

IT IS AN OBJECT OF THE PRESENT INVENTION TO PROVIDE AN EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION WHICH HAS GOOD SOLDER HEAT RESISTANCE AND EXCELLENT PRODUCTIVITY, AND A SEMICONDUCTOR DEVICE. THE INVENTION SOLVES THE PROBLEMS BY MEANS OF AN EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCA...

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1. Verfasser:	HIROKI NIKAIDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:	IT IS AN OBJECT OF THE PRESENT INVENTION TO PROVIDE AN EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION WHICH HAS GOOD SOLDER HEAT RESISTANCE AND EXCELLENT PRODUCTIVITY, AND A SEMICONDUCTOR DEVICE. THE INVENTION SOLVES THE PROBLEMS BY MEANS OF AN EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION COMPRISING (A) AN EPOXY RESIN, (B) A PHENOLIC RESIN, (C) (C-1) AN ORGANOPOLYSILOXANE HAVING A CARBOXYL GROUP AND/OR (C-2) A REACTION PRODUCT BETWEEN AN ORGANOPOLYSILOXANE HAVING A CARBOXYL GROUP AND AN EPOXY RESIN, AND (D) A TRI-FATTY ACID ESTER OF GLYCEROL.