LASER BEAM MACHINING METHOD, LASER BEAM MACHINING APPARATUS, AND LASER BEAM MACHINED PRODUCT

IT IS AN OBJECT TO PROVIDE A LASER BEAM MACHINING METHOD WHICH CAN EASILY CUT A MACHINING TARGET. THE LASER BEAM MACHINING METHOD IRRADIATES LASER LIGHT WHILE POSITIONING A FOCUS POINT AT THE INSIDE OF A MACHINING TARGET TO THEREBY FORM A TREATED AREA BASED ON MULTIPHOTON ABSORPTION ALONG A PLANNED...

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1. Verfasser:	KENSHI FUKUMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Zusammenfassung:	IT IS AN OBJECT TO PROVIDE A LASER BEAM MACHINING METHOD WHICH CAN EASILY CUT A MACHINING TARGET. THE LASER BEAM MACHINING METHOD IRRADIATES LASER LIGHT WHILE POSITIONING A FOCUS POINT AT THE INSIDE OF A MACHINING TARGET TO THEREBY FORM A TREATED AREA BASED ON MULTIPHOTON ABSORPTION ALONG A PLANNED CUTTING LINE OF THE MACHINING TARGET INSIDE THE MACHINING TARGET AND ALSO FORM A MINUTE CAVITY AT A PREDETERMINED POSITION CORRESPONDING TO THE TREATED AREA IN THE MACHINING TARGET.