METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE

METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE

DISCLOSED IS A METHOD OF FABRICATING A LIGHT-EMITTING DIODE PACKAGE (100), WHICH COMPRISES A LIGHT-EMITTING CHIP (104) OPERATIVE TO EMIT LIGHT OF A FIRST WAVELENGTH RANGE. THE METHOD COMPRISES THE STEPS OF: DISPENSING A PHOTOLUMINESCENT MIXTURE ON THE LIGHT-EMITTING CHIP (104), THE PHOTOLUMINESCENT...

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Bibliographische Detailangaben
Hauptverfasser: WONG YIU YAN, LI MING, LAM KUI KAM, MAK KA YEE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:DISCLOSED IS A METHOD OF FABRICATING A LIGHT-EMITTING DIODE PACKAGE (100), WHICH COMPRISES A LIGHT-EMITTING CHIP (104) OPERATIVE TO EMIT LIGHT OF A FIRST WAVELENGTH RANGE. THE METHOD COMPRISES THE STEPS OF: DISPENSING A PHOTOLUMINESCENT MIXTURE ON THE LIGHT-EMITTING CHIP (104), THE PHOTOLUMINESCENT MIXTURE BEING CAPABLE OF ABSORBING A PORTION OF LIGHT OF THE FIRST WAVELENGTH RANGE EMITTED FROM THE LIGHT-EMITTING CHIP (104) TO RE-EMIT LIGHT OF A SECOND WAVELENGTH RANGE; PARTIALLY CURING THE PHOTOLUMINESCENT MIXTURE BY HEATING THE PHOTOLUMINESCENT MIXTURE TO A PRE-CURING TEMPERATURE AND THEN COOLING THE PHOTOLUMINESCENT MIXTURE TO BELOW THE PRE-CURING TEMPERATURE; AND FULLY CURING THE PHOTOLUMINESCENT MIXTURE TO HARDEN THE PHOTOLUMINESCENT MIXTURE. AN APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE IS ALSO DISCLOSED. (FIG.3)