FLUX FOR SOLDER PASTE AND SOLDER PASTE

DISCLOSED IS A SOLDER PASTE WHICH HAS ADEQUATE FLUIDITY EVEN AFTER A SHEAR FORCE IS REPEATEDLY APPLIED THERETO BY A SCREEN PRINTING METHOD OR THE LIKE. SPECIFICALLY DISCLOSED IS A FLUX FOR A SOLDER PASTE, WHICH CONTAINS: AN ACRYLIC RESIN THAT IS OBTAINED BY RADICALLY COPOLYMERIZING A (METH) ACRYLIC...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WADA,RIE, OKOCHI,TERUO, UTSUNO,MASAYOSHI, SANJI,MASAKI, NAKANISHI,KENSUKE, KUMAMOTO,SEISHI, IKEDO,KENSHI, MORI,KIMIAKI, NAKAMURA,ATSUO, GOTOH,KAZUSHI, IWAMURA,EIJI, SHIRAI,TAKESHI, ANDOH,YOSHIYUKI, SUKEKAWA,TAKUJI, AIHARA,MASAMI, NAGASAKA,SHINSUKE, YOSHIOKA,TAKAYASU
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	DISCLOSED IS A SOLDER PASTE WHICH HAS ADEQUATE FLUIDITY EVEN AFTER A SHEAR FORCE IS REPEATEDLY APPLIED THERETO BY A SCREEN PRINTING METHOD OR THE LIKE. SPECIFICALLY DISCLOSED IS A FLUX FOR A SOLDER PASTE, WHICH CONTAINS: AN ACRYLIC RESIN THAT IS OBTAINED BY RADICALLY COPOLYMERIZING A (METH) ACRYLIC ACID ESTER HAVING A C6-C15 ALKYL GROUP AND A (METH) ACRYLIC ACID ESTER OTHER THAN THE ABOVE-MENTIONED (METH) ACRYLIC ACID ESTER; AND A ROSIN. WHEN THE WEIGHT OF THE ROSIN IS TAKEN AS 1, THE WEIGHT RATIO OF THE ACRYLIC RESIN IS 0.5-1.2 (INCLUSIVE), AND THE FLUX FOR A SOLDER PASTE IS FLUIDIZED BY THE APPLICATION OF A SHEAR FORCE OF 10-150 Pa (INCLUSIVE). THE MOST ILLUSTRATED DRAWING IS