DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE AND METHODS OF MANUFACTURE

AN INTEGRATED POWER DEVICE MODULE (102) INCLUDING A LEAD FRAME (32, 34) HAVING FIRST AND SECOND SPACED PADS (78, 80), ONE OR MORE COMMON SOURCE-DRAIN LEADS (88, 90, 92) LOCATED BETWEEN THE FIRST AND SECOND PADS (78, 80), AND ONE OR MORE DRAIN LEADS (94, 96, 98, 100) LOCATED ON THE OUTSIDE OF THE SECOND PAD (80). FIRST AND SECOND TRANSISTORS (44, 46) ARE FLIP CHIP ATTACHED RESPECTIVELY TO THE FIRST AND SECOND PADS (78, 80), WHEREIN THE SOURCE OF THE SECOND TRANSISTOR (46) IS ELECTRICALLY CONNECTED TO THE ONE OR MORE COMMON SOURCE-DRAIN LEADS (88, 90, 92). A FIRST CLIP (40) IS ATTACHED TO THE DRAIN OF THE FIRST TRANSISTOR (44) AND ELECTRICALLY CONNECTED TO THE ONE OR MORE COMMON SOURCE-DRAIN LEADS (88, 90, 92). A SECOND CLIP (42) IS ATTACHED TO THE DRAIN OF THE SECOND TRANSISTOR (46) AND ELECTRICALLY CONNECTED TO THE ONE OR MORE DRAIN LEADS (94, 96, 98, 100) LOCATED ON THE OUTSIDE OF THE SECOND PAD (80). MOLDING MATERIAL (68) ENCAPSULATES THE LEAD FRAME (32, 34), THE TRANSISTORS (44, 46), AND THE CLIPS (40, 42) TO FORM THE MODULE (102).