AN IMPROVED DEVICE FOR HIGH-SPEED INSPECTION OF IC CHIPS AND A METHOD THEREFOR

AN IMPROVED DEVICE FOR HIGH-SPEED INSPECTION OF IC CHIPS / DIES (220) AND A METHOD OF INSPECTING IC CHIPS / DIES (220) USING THE SAID IMPROVED DEVICE HAVE BEEN PROVIDED. THE IMPROVED DEVICE FOR HIGH-SPEED INSPECTION OF IC CHIPS (220) IS INEXPENSIVE, EASY TO OPERATE AND PRECISELY INSPECTS THE SILICON CHIPS / IC CHIPS / IC DIES-UNDER-INSPECTION (220) WITH LESSER TIME COMPARED TO THE OTHER EXISTING DEVICES. A PLURALITY OF JIGS (221) IS DESIGNED IN SUCH A FASHION TO HAVE A CAVITY INSIDE THE JIGS (221) SO THAT THE JIGS (221) CAN ACCOMMODATE A PLURALITY OF AIR-SUCTION TUBES (115). A PLURALITY OF CAMERAS (119, 215) AND A PLURALITY OF POLARIZERS / LIGHT SOURCES (210) PICK THE IMAGES OF ANY KIND OF CHIPS-UNDER-INSPECTION, I.E., DEVICE UNDER TESTING (DUT) (220). A PLURALITY OF SENSING ELEMENTS (211, 212) AND SENSORS (217) ARE ELECTRONICALLY CONNECTED TO A CPU (118) AND SENSES THE INACCURACY, IF ANY, OF THE DUTs, I.E., THE SILICON CHIPS / IC CHIPS / IC DIES-UNDER-INSPECTION (220). THE PLURALITY OF JIGS (221) HAVE PLURALITY OF PIVOTED STANDS TO CAPTURE THE SAID PLURALITY OF DUTs (220) WHILE USING AN AIR FLOW SYSTEM TO REDUCE DAMAGE OR TO REDUCE DIGITAL CONTACTS ON THE SAID PLURALITY OF CHIPS (220). A TEST HANDLER (311) HAVING SENSING ELEMENTS (319) IS LOCATED TO TEST THE SAID DUTs (220).