THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS

THERMOPLASTIC MOLDING MATERIALS COMPRISING A) FROM 10 TO 69% BY WEIGHT OF A THERMOPLASTIC POLYESTER, B) FROM 30 TO 79% BY WEIGHT OF AN ALUMINUM OXIDE, C) FROM 0.01 TO 10% BY WEIGHT OF ALL ORGANIC OR INORGANIC ACID OR MIXTURES THEREOF, D) FROM 0 TO 10% BY WEIGHT OF D1) AT LEAST ONE HIGHLY BRANCHED OR...

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Hauptverfasser:	FUKUHARA, HIROKI, WEIS, CARSTEN, ASMANN, JENS, WEBER, MARTIN, EIPPER, ANDREAS, VOELKEL, MARK, STRANSKY, REINHARD
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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