THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS

THERMOPLASTIC MOLDING MATERIALS COMPRISING A) FROM 10 TO 69% BY WEIGHT OF A THERMOPLASTIC POLYESTER, B) FROM 30 TO 79% BY WEIGHT OF AN ALUMINUM OXIDE, C) FROM 0.01 TO 10% BY WEIGHT OF ALL ORGANIC OR INORGANIC ACID OR MIXTURES THEREOF, D) FROM 0 TO 10% BY WEIGHT OF D1) AT LEAST ONE HIGHLY BRANCHED OR...

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Hauptverfasser: FUKUHARA, HIROKI, WEIS, CARSTEN, ASMANN, JENS, WEBER, MARTIN, EIPPER, ANDREAS, VOELKEL, MARK, STRANSKY, REINHARD
Format: Patent
Sprache:eng
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Zusammenfassung:THERMOPLASTIC MOLDING MATERIALS COMPRISING A) FROM 10 TO 69% BY WEIGHT OF A THERMOPLASTIC POLYESTER, B) FROM 30 TO 79% BY WEIGHT OF AN ALUMINUM OXIDE, C) FROM 0.01 TO 10% BY WEIGHT OF ALL ORGANIC OR INORGANIC ACID OR MIXTURES THEREOF, D) FROM 0 TO 10% BY WEIGHT OF D1) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYCARBONATE HAVING AN OH NUMBER OF FROM 1 TO 600 MG KOH/G OF POLYCARBONATE (TO DIN 53240. PART 2) OR D2) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYESTER OF THE AXBY TYPE WHERE X IS AT LEAST 1.1 AND Y IS AT LEAST 2.1 OR MIXTURES THEREOF, E) FROM 0 TO 50% BY WEIGHT OF FURTHER ADDITIVES. WHERE THE SUM OF THE PERCENTAGES BY WEIGHT OF COMPONENTS A) TO E) ADDS UP TO 100%.