THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS
THERMOPLASTIC MOLDING MATERIALS COMPRISING A) FROM 10 TO 69% BY WEIGHT OF A THERMOPLASTIC POLYESTER, B) FROM 30 TO 79% BY WEIGHT OF AN ALUMINUM OXIDE, C) FROM 0.01 TO 10% BY WEIGHT OF ALL ORGANIC OR INORGANIC ACID OR MIXTURES THEREOF, D) FROM 0 TO 10% BY WEIGHT OF D1) AT LEAST ONE HIGHLY BRANCHED OR...
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creator | FUKUHARA, HIROKI WEIS, CARSTEN ASMANN, JENS WEBER, MARTIN EIPPER, ANDREAS VOELKEL, MARK STRANSKY, REINHARD |
description | THERMOPLASTIC MOLDING MATERIALS COMPRISING A) FROM 10 TO 69% BY WEIGHT OF A THERMOPLASTIC POLYESTER, B) FROM 30 TO 79% BY WEIGHT OF AN ALUMINUM OXIDE, C) FROM 0.01 TO 10% BY WEIGHT OF ALL ORGANIC OR INORGANIC ACID OR MIXTURES THEREOF, D) FROM 0 TO 10% BY WEIGHT OF D1) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYCARBONATE HAVING AN OH NUMBER OF FROM 1 TO 600 MG KOH/G OF POLYCARBONATE (TO DIN 53240. PART 2) OR D2) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYESTER OF THE AXBY TYPE WHERE X IS AT LEAST 1.1 AND Y IS AT LEAST 2.1 OR MIXTURES THEREOF, E) FROM 0 TO 50% BY WEIGHT OF FURTHER ADDITIVES. WHERE THE SUM OF THE PERCENTAGES BY WEIGHT OF COMPONENTS A) TO E) ADDS UP TO 100%. |
format | Patent |
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subjects | CHEMISTRY COMPOSITIONS BASED THEREON METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS |
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