CLEANING METHOD FOR REMOVING POST VIA ETCH RESIDUE

CLEANING METHOD FOR REMOVING POST VIA ETCH RESIDUE

THE PRESENT INVENTION RELATES GENERALLY TO A METHOD FOR EFFECTIVELY REMOVING POST VIA ETCH RESIDUE(1) INCLUDING FLUORINATED BY-PRODUCT (12) AND HENCE ENHANCES FUNCTIONAL PRODUCT YIELD BY FIRST TREATING THE ETCHED WAFER WITH A PRELIMINARY SOLVENT CLEANING TREATMENT (4) PRIOR TO CONVENTIONAL PLASMA RE...

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Hauptverfasser: ZALIHA BINTI MOHAMAD, HAZIAN BIN MAMAT, MAZLIN BIN MAN, AZLINA BINTI MOHD ZAIN, ADZMIR BIN ABD LATIF
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:THE PRESENT INVENTION RELATES GENERALLY TO A METHOD FOR EFFECTIVELY REMOVING POST VIA ETCH RESIDUE(1) INCLUDING FLUORINATED BY-PRODUCT (12) AND HENCE ENHANCES FUNCTIONAL PRODUCT YIELD BY FIRST TREATING THE ETCHED WAFER WITH A PRELIMINARY SOLVENT CLEANING TREATMENT (4) PRIOR TO CONVENTIONAL PLASMA RESIST STRIPPING TREATMENT (6) AND THEREAFTER A SUBSEQUENT SOLVENT CLEANING TREATMENT (8).