ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRUCTURE AND METHOD

ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRUCTURE AND METHOD

IN ONE EMBODIMENT, AN ENCAPSULATED ELECTRONIC PACKAGE INCLUDES A SEMICONDUCTOR CHIP (12) HAVING PATTERNED SOLDERABLE PADS (21) ARE DIRECTLY AFFIXED TO CONDUCTIVE LEADS (17). THE ASSEMBLY IS ENCAPSULATED USING, FOR EXAMPLE, A MAP OVER-MOLDING PROCESS, AND THEN PLACED THROUGH A SEPARATION PROCESS TO P...

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Bibliographische Detailangaben
Hauptverfasser: DENISE THIENPONT, JAMES P. LETTERMAN, JR, JOSEPH K. FAUTY
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:IN ONE EMBODIMENT, AN ENCAPSULATED ELECTRONIC PACKAGE INCLUDES A SEMICONDUCTOR CHIP (12) HAVING PATTERNED SOLDERABLE PADS (21) ARE DIRECTLY AFFIXED TO CONDUCTIVE LEADS (17). THE ASSEMBLY IS ENCAPSULATED USING, FOR EXAMPLE, A MAP OVER-MOLDING PROCESS, AND THEN PLACED THROUGH A SEPARATION PROCESS TO PROVIDE INDIVIDUAL CHIP SCALE PACKAGES HAVING FLIP-CHIP ON LEAD FRAME INTERCONNECTS.