CONTROLLED ELECTROCHEMICAL POLISHING METHOD
THE INVENTION RELATES TO A METHOD OF POLISHING A SUBSTRATE COMPRISING AT LEAST ONE METAL LAYER BY APPLYING AN ELECTROCHEMICAL POTENTIAL BETWEEN THE SUBSTRATE AND AT LEAST ONE ELECTRODE IN CONTACT WITH A POLISHING COMPOSITION COMPRISING A REDUCING AGENT OR AN OXIDIZING AGENT.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | THE INVENTION RELATES TO A METHOD OF POLISHING A SUBSTRATE COMPRISING AT LEAST ONE METAL LAYER BY APPLYING AN ELECTROCHEMICAL POTENTIAL BETWEEN THE SUBSTRATE AND AT LEAST ONE ELECTRODE IN CONTACT WITH A POLISHING COMPOSITION COMPRISING A REDUCING AGENT OR AN OXIDIZING AGENT. |
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