VISION SYSTEM FOR POSITIONING A BONDING TOOL
AN APPARATUS FOR CORRECTING A POSITIONAL OFFSET OF A BONDING TOOL (10) DURING BONDING OPERATIONS COMPRISES A FIRST FIDUCIAL MARK AND A SECOND FIDUCIAL MARK (12, 13) SPACED FROM THE FIRST FIDUCIAL MARK (12) LOCATED ON THE BONDING TOOL (10). A FIRST IMAGING PATH (18) EMANATES FROM THE FIRST FIDUCIAL M...
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| creator | FUNG KA FAI FUNG SHUN MING, KENNETH LEUNG WING HONG CHUNG KWOK KEE MOK CHI LEUNG, VINCENT |
| description | AN APPARATUS FOR CORRECTING A POSITIONAL OFFSET OF A BONDING TOOL (10) DURING BONDING OPERATIONS COMPRISES A FIRST FIDUCIAL MARK AND A SECOND FIDUCIAL MARK (12, 13) SPACED FROM THE FIRST FIDUCIAL MARK (12) LOCATED ON THE BONDING TOOL (10). A FIRST IMAGING PATH (18) EMANATES FROM THE FIRST FIDUCIAL MARK (12) AND A SECOND IMAGING PATH (20) EMANATES FROM THE SECOND FIDUCIAL MARK (13) WHEN THE FIRST AND SECOND FIDUCIAL MARKS (12, 13) ARE ILLUMINATED AT A REFERENCE POSITION. AN OPTICAL SYSTEM IS POSITIONED ALONG THE FIRST AND SECOND IMAGING PATHS (18, 20) TO VIEW IMAGES OF THE FIRST AND SECOND FIDUCIAL MARKS (12, 13). A PROCESSOR IS OPERATIVE TO CALCULATE A CURRENT POSITION OF THE BONDING TOOL (10) AND TO COMPARE IT TO A DESIRED POSITION SO THAT THE BONDING TOOL'S (10) POSITIONAL OFFSET MAY BE CORRECTED BY MOVING IT TO THE DESIRED POSITION. |
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A PROCESSOR IS OPERATIVE TO CALCULATE A CURRENT POSITION OF THE BONDING TOOL (10) AND TO COMPARE IT TO A DESIRED POSITION SO THAT THE BONDING TOOL'S (10) POSITIONAL OFFSET MAY BE CORRECTED BY MOVING IT TO THE DESIRED POSITION.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; PERFORMING OPERATIONS ; PHYSICS ; REGULATING ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111205&DB=EPODOC&CC=MY&NR=144978A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111205&DB=EPODOC&CC=MY&NR=144978A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUNG KA FAI</creatorcontrib><creatorcontrib>FUNG SHUN MING, KENNETH</creatorcontrib><creatorcontrib>LEUNG WING HONG</creatorcontrib><creatorcontrib>CHUNG KWOK KEE</creatorcontrib><creatorcontrib>MOK CHI LEUNG, VINCENT</creatorcontrib><title>VISION SYSTEM FOR POSITIONING A BONDING TOOL</title><description>AN APPARATUS FOR CORRECTING A POSITIONAL OFFSET OF A BONDING TOOL (10) DURING BONDING OPERATIONS COMPRISES A FIRST FIDUCIAL MARK AND A SECOND FIDUCIAL MARK (12, 13) SPACED FROM THE FIRST FIDUCIAL MARK (12) LOCATED ON THE BONDING TOOL (10). 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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS REGULATING SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | VISION SYSTEM FOR POSITIONING A BONDING TOOL |
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