POLISHING APPARATUS

THE POLISHING APPARATUS (10) IS CAPABLE OF PRECISELY CONTROLLING POLISHING PRESSURE, CORRECTLY POSITIONING A PRESS PLATE (47) AND UNIFORMLY POLISHING A WORKPIECE (W). IN THE POLISHING APPARATUS (10), A HOLDING HEAD COMPRISES: FIRST PRESSING MEANS FOR INTRODUCING A PRESSURIZED FLUID INTO A FIRST FLUI...

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Bibliographische Detailangaben
Hauptverfasser:	HIROMI KISHIDA, TADAKAZU MIYASHITA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	THE POLISHING APPARATUS (10) IS CAPABLE OF PRECISELY CONTROLLING POLISHING PRESSURE, CORRECTLY POSITIONING A PRESS PLATE (47) AND UNIFORMLY POLISHING A WORKPIECE (W). IN THE POLISHING APPARATUS (10), A HOLDING HEAD COMPRISES: FIRST PRESSING MEANS FOR INTRODUCING A PRESSURIZED FLUID INTO A FIRST FLUID CHAMBER (39) AND PRESSING A MAIN HEAD SECTION (24) DOWNWARD; SECOND PRESSING MEANS FOR INTRODUCING A PRESSURIZED FLUID INTO A SECOND FLUID CHAMBER (50) AND PRESSING A PRESS PLATE (47) DOWNWARD; AND THIRD PRESSING MEANS FOR INTRODUCING A PRESSURIZED FLUID INTO A THIRD FLUID CHAMBER (64) AND PRESSING THE WORKPIECE (W) DOWNWARD. WITH THIS STRUCTURE, THE WORKPIECE (W) IS HELD ON THE LOWER SIDE OF AN ELASTIC SHEET MEMBER (63), AND THE LOWER FACE OF THE WORKPIECE (W) CAN BE POLISHED BY A POLISHING PLATE (14).