CAPILLARY FOR WIRE BONDING

A CAPILLARY TIP FOR DEFORMING A BONDING WIRE DURING BONDING OF THE WIRE TO A BONDING SURFACE COMPRISES A BOTTOM FACE ALONG AN INNER PERIPHERY OF THE CAPILLARY TIP FOR PRESSING THE BONDING WIRE AGAINST A BONDING SURFACE, AN OUTER RADIUS ALONG AN OUTER PERIPHERY OF THE CAPILLARY TIP, AND INCLUDES A FI...

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Bibliographische Detailangaben
Hauptverfasser:	LIM LOON AIK, VATH III CHARLES J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A CAPILLARY TIP FOR DEFORMING A BONDING WIRE DURING BONDING OF THE WIRE TO A BONDING SURFACE COMPRISES A BOTTOM FACE ALONG AN INNER PERIPHERY OF THE CAPILLARY TIP FOR PRESSING THE BONDING WIRE AGAINST A BONDING SURFACE, AN OUTER RADIUS ALONG AN OUTER PERIPHERY OF THE CAPILLARY TIP, AND INCLUDES A FIRST INCLINED FACE ADJACENT TO THE BOTTOM FACE AND EXTENDING OBLIQUELY TO THE BOTTOM FACE AS WELL AS A SECOND INCLINED FACE ADJACENT TO THE FIRST INCLINED FACE AND EXTENDING OBLIQUELY TO THE FIRST INCLINED FACE. (