COMBINATIONS OF RESIN COMPOSITIONS AND METHODS OF USE THEROF

A COMPOSITION FOR USE AS UNDERFILL MATERIAL IS PROVIDED. THE UNDERFILL MATERIAL INCLUDES A FIRST CURABLE TRANSPARENT RESIN COMPOSITION AND A SECOND CURABLE FLUXING RESIN COMPOSITION. THE FIRST CURABLE RESIN COMPOSITION INCLUDES AT LEAST ONE AROMATIC EPOXY RESIN IN COMBINATION WITH A SOLVENT, A FUNCT...

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Bibliographische Detailangaben
Hauptverfasser:	RUBINSZTAJN, SLAWOMIR, TONAPI, SANDEEP SHRIKANT, CAMPBELL, JOHN, PRABHAKUMAR, ANANTH, MILLS, RYAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	A COMPOSITION FOR USE AS UNDERFILL MATERIAL IS PROVIDED. THE UNDERFILL MATERIAL INCLUDES A FIRST CURABLE TRANSPARENT RESIN COMPOSITION AND A SECOND CURABLE FLUXING RESIN COMPOSITION. THE FIRST CURABLE RESIN COMPOSITION INCLUDES AT LEAST ONE AROMATIC EPOXY RESIN IN COMBINATION WITH A SOLVENT, A FUNCTIONALIZED COLLOIDAL SILICA DISPERSION, AND AT LEAST ONE OTHER COMPONENT SELECTED FROM THE GROUP CONSISTING OF CYCLOALIPHATIC EPOXY MONOMERS, ALIPHATIC EPOXY MONOMERS, HYDROXY AROMATIC COMPOUNDS AND COMBINATIONS AND MIXTURES THEREOF, THEREBY FORMING A SOLVENT-MODIFIED RESIN. THE SECOND CURABLE FLUXING COMPOSITION INCLUDES AT LEAST ONE EPOXY RESIN. THE COMBINATION OF THE TWO RESIN COMPOSITIONS IS USEFUL IN PRODUCING UNDERFILL MATERIALS AND IS SUITABLE FOR USE AS AN ENCAPSULANT FOR ELECTRONIC CHIPS.