METHOD AND APPARATUS FOR ATTACHING A PEELING TAPE

33 METHOD AND APPARATUS FOR ATTACHING A PEELING TAPE W(04 ABSTRACT OF THE DISCLOSURE IN A PEELING TAPE ATTACHING METHOD FOR ATTACHING A PEELING TAPE (4) ON A SURFACE PROTECTIVE FILM (11) 5 ATTACHED ON THE SURFACE OF A WAFER (20), THE WAFER IS SUPPORTED ON A MOVABLE TABLE (31) WITH THE SURFACE PROTEC...

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1. Verfasser:	MINORU AMETANI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Zusammenfassung:	33 METHOD AND APPARATUS FOR ATTACHING A PEELING TAPE W(04 ABSTRACT OF THE DISCLOSURE IN A PEELING TAPE ATTACHING METHOD FOR ATTACHING A PEELING TAPE (4) ON A SURFACE PROTECTIVE FILM (11) 5 ATTACHED ON THE SURFACE OF A WAFER (20), THE WAFER IS SUPPORTED ON A MOVABLE TABLE (31) WITH THE SURFACE PROTECTIVE FILM UP AND THE PEELING TAPE IS SUPPLIED ON THE SURFACE PROTECTIVE FILM OF THE WAFER. THE MOVABLE TABLE IS MOVED IN SUCH A MANNER THAT AN END (28) OF THE 110 WAFER IS LOCATED UNDER A PEELING TAPE ATTACHING UNIT (46), AND PRESSURE IS EXERTED BY PRESSING THE PEELING TAPE ATTACHING UNIT AGAINST THE SURFACE PROTECTIVE FILM OF THE WAFER VIA THE PEELING TAPE. AFTER THAT, THE MOVABLE TABLE IS MOVED TOWARD THE OTHER END (29) OF THE 15 WAFER, AND UPON MOVEMENT OF THE MOVABLE TABLE, BY A PREDETERMINED D4STANCE, FROM THE PEELING TAPE ATTACHING UNIT, THE PRESSURE IS CANCELED. AS A RESULT, THE WAFER IS PREVENTED FROM CRACKING AT THE TIME OF ATTACHING THE PEELING TAPE. FURTHER, A PEELING TAPE ATTACHING 20 APPARATUS FOR CARRYING OUT THIS METHOD IS PROVIDED.