CAPILLARY IMPRINTING TECHNIQUE

@THE PRESENT INVENTION PROVIDES A METHOD FOR PATTERNING A SUBSTRATE WITH A TEMPLATE HAVING A MOLD THAT FEATURES POSITIONING CONFORMABLE MATERIAL BETWEEN THE SUBSTRATE AND THE MOLD AND FILLING A VOLUME DEFINED BETWEEN THE MOLD THE SUBSTRATE WITH THE CONFORMABLE MATERIAL THROUGH CAPILLARY ACTION BETWE...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BYUNG-JIN CHOI, SIDLGATA V. SREENIVASAN, MICHAEL P.C. WATTS
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS THEREFOR METALLURGY MICROSTRUCTURAL TECHNOLOGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	@THE PRESENT INVENTION PROVIDES A METHOD FOR PATTERNING A SUBSTRATE WITH A TEMPLATE HAVING A MOLD THAT FEATURES POSITIONING CONFORMABLE MATERIAL BETWEEN THE SUBSTRATE AND THE MOLD AND FILLING A VOLUME DEFINED BETWEEN THE MOLD THE SUBSTRATE WITH THE CONFORMABLE MATERIAL THROUGH CAPILLARY ACTION BETWEEN THE CONFORMABLE MATERIAL AND ONE OF THE MOLD AND THE SUBSTRARE. THEREAFTER, THE CONFORMABLE MATERIAL IS SOLIDIFIED. SPECIFICALLY, THE DISTANCE BETWEEN THE MOLD AND THE SUBSTRATE IS CONTROLLED TO A SUFFICIENT DEGREE TO ATTENUATE, IF NOT AVOID, COMPRESSIVE FORCES BETWEEN THE MOLD AND THE SUBSTRATE. AS A RESULT, UPON INITIAL CONTACT OF THE MOLD WITH THE CONFORMABLE MATERIAL, SPONTANEOUS CAPILLARY FILLING OF THE VOLUME BETWEEN THE MOLD AND THE SUBSTRATE OCCURS.