APPLYING IMPRINTING MATERIAL TO SUBSTRATES EMPLOYING ELECTROMAGNETIC FIELDS

[0029]THE PRESENT INVENTION COMPRISES A METHOD FOR APPLYING A LIQUID, SUCH AS IMPRINTING MATERIAL, TO A SUBSTRATE THAT FEATURES USE OF AN ELECTROMAGNETIC FIELD TO RAPIDLY SPREAD THE LIQUID OVER A DESIRED PORTION OF THE SUBSTRATE, WHILE CONFINING THE SAME TO THE DESIRED REGION.

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Bibliographische Detailangaben
Hauptverfasser:	ANSHUMAN CHERALA, SIDLGATA V. SREENIVASAN, NORMAN E. SCHUMAKER
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NANOTECHNOLOGY NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	[0029]THE PRESENT INVENTION COMPRISES A METHOD FOR APPLYING A LIQUID, SUCH AS IMPRINTING MATERIAL, TO A SUBSTRATE THAT FEATURES USE OF AN ELECTROMAGNETIC FIELD TO RAPIDLY SPREAD THE LIQUID OVER A DESIRED PORTION OF THE SUBSTRATE, WHILE CONFINING THE SAME TO THE DESIRED REGION.