LAMINATING METHOD OF FILM-SHAPED ORGANIC DIE-BONDING MATERIAL, DIE-BONDING METHOD, LAMINATING MACHINE AND DIE-BONDING APPARATUS, SEMICONDUCTOR DEVICE, AND FABRICATION PROCESS OF SEMICONDUCTOR DEVICE

PROVIDED ARE A LAMINATING METHOD AND MACHINE FOR SUCCESSIVELY HEATING AND COMPRESSION-BONDING A FILM-SHAPED ORGANIC DIE-BONDING MATERIAL ON A LEADFRAME.A LEADFRAME 7 IS PLACED ON A TRAVELLING TABLE 8 AND IS HEATED THERE. A FILM-SHAPED ORGANIC DIE-BONDING MATERIAL 2 IS PUNCHED OUT AND THE RESULTING FILM IS TACK-BONDED TO A DIE PAD ON SAID LEADFRAME. SAID LEADFRAME WITH SAID FILM TACK-BONDED THEREON IS THEN MOVED TO A POSITION B BY SAID TRAVELLING TABLE. AFTER SAID FILM IS PRESSED BY A COMPRESSION-BONDING ELEMENT AT SAID POSITION B, A CHIP IS MOUNTED ON SAID FILM-SHAPED ORGANIC DIE-BONDING MATERIAL 2.IT IS THEREFORE POSSIBLE TO BOND A FILM-SHAPED ORGANIC DIE-BONDING MATERIAL UNDER COMPRESSION ON A LEADFRAME WITH GOOD PRODUCTIVITY BUT WITHOUT VOIDS AND FURTHER TO AVOID PACKAGE CRACKING UPON MOUNTING A CHIP.(FIG. 1)