SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

A SEMICONDUCTOR CHIP (8) IS ATTACHED TO A LEAD FRAME (5) WITH A FILMY ORGANIC DIE-BONDING MATERIAL (1) HAVING A WATER ABSORPTION OF 1.5% BY VOLUME OR LESS; HAVING A SATURATION MOISTURE ABSORPTION OF 1.0% BY VOLUME OR LESS, HAVING A RESIDUAL VOLATILE COMPONENT IN AN AMOUNT NOT MORE THAN 3.0% BY WEIGH...

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Bibliographische Detailangaben
Hauptverfasser:	MASAMI YUSA, TAKASHI MASUKO, AIZOU KANEDA, SHINJI TAKEDA, YASUO MIYADERA, MITUO YAMASAKI, IWAO MAEKAWA, TOORU KIKUCHI, AKIRA KAGEYAMA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Zusammenfassung:	A SEMICONDUCTOR CHIP (8) IS ATTACHED TO A LEAD FRAME (5) WITH A FILMY ORGANIC DIE-BONDING MATERIAL (1) HAVING A WATER ABSORPTION OF 1.5% BY VOLUME OR LESS; HAVING A SATURATION MOISTURE ABSORPTION OF 1.0% BY VOLUME OR LESS, HAVING A RESIDUAL VOLATILE COMPONENT IN AN AMOUNT NOT MORE THAN 3.0% BY WEIGHT, HAVING A MODULUS OF ELASTICITY OF 10 MPA OR LESS AT A TEMPERATURE OF 250ºC.THE SEMICONDUCTOR DEVICE THUS OBTAINED CAN BE FREE FROM OCCURRENCE OF REFLOW CRACKS DURING REFLOW SOLDERING FOR THE PACKAGING OF SEMICONDUCTOR DEVICES.