METHOD AND APPARATUS FOR CONTROLLING FLATNESS OF POLISHED SEMICONDUCTOR WAFER

APPARATUS FOR DETERMINING THE FLATNESS OF A GENERALLY CIRCULAR POLISHING PAD THROUGH DIRECT MEASUREMENT OF THE PAD FOR USE IN MAINTAINING THE FLATNESS OF THE PAD AND THE FLATNESS OF SURFACES OF ARTICLES POLISHED ON THE POLISHING PAD OF A POLISHER. THE APPARATUS INCLUDES A MEASURING DEVICE, A FRAME M...

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Hauptverfasser:	TROY W. ADCOCK, HAROLD E. HALL, JR, MICHAEL S. WISNIESKI, ANKUR H. DESAI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PERFORMING OPERATIONS PHYSICS POLISHING SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Zusammenfassung:	APPARATUS FOR DETERMINING THE FLATNESS OF A GENERALLY CIRCULAR POLISHING PAD THROUGH DIRECT MEASUREMENT OF THE PAD FOR USE IN MAINTAINING THE FLATNESS OF THE PAD AND THE FLATNESS OF SURFACES OF ARTICLES POLISHED ON THE POLISHING PAD OF A POLISHER. THE APPARATUS INCLUDES A MEASURING DEVICE, A FRAME MOUNTING THE MEASURING DEVICE BEING CAPABLE OF MEASURING A DISTANCE BETWEEN AN UPPER SURFACE OF THE POLISHING PAD AND A REFERENCE PLANE AT PLURAL LOCATIONS ALONG THE POLISHING PAD. THE APPARATUS FURTHER INCLUDES A CONTROLLER FOR CONTROLLING THE MEASURING DEVICE. THE CONTROLLER IS CONFIGURED TO INDICATE WHETHER THE FLATNESS OF THE PAD FALLS OUTSIDE A PREDETERMINED SPECIFICATION.