WIRE BOND-LESS ELECTRONIC COMPONENT FOR USE WITH AN EXTERNAL CIRCUIT AND METHOD OF MANUFACTURE

WIRE BOND-LESS ELECTRONIC COMPONENT FOR USE WITH AN EXTERNAL CIRCUIT AND METHOD OF MANUFACTURE

A WIRE BOND-LESS ELECTRONIC COMPONENT IS FOR USE WITH A CIRCUIT EXTERNAL TO THE WIRE BOND-LESS ELECTRONIC COMPONENT. THE WIRE BOND-LESS ELECTRONIC COMPONENT INCLUDES A SUPPORT SUBSTRATE (110, 410), AN ELECTRONIC DEVICE (130) OVER THE SUPPORT SUBSTRATE, AND A COVER (140, 440, 540) LOCATED OVER THE EL...

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Bibliographische Detailangaben
Hauptverfasser: DAVIDSON, ROBERT P, VISWANATHAN, LAKSHMINARAYAN, FUNK, GARRY DUANE, PIEL, PIERRE-MARIE J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:A WIRE BOND-LESS ELECTRONIC COMPONENT IS FOR USE WITH A CIRCUIT EXTERNAL TO THE WIRE BOND-LESS ELECTRONIC COMPONENT. THE WIRE BOND-LESS ELECTRONIC COMPONENT INCLUDES A SUPPORT SUBSTRATE (110, 410), AN ELECTRONIC DEVICE (130) OVER THE SUPPORT SUBSTRATE, AND A COVER (140, 440, 540) LOCATED OVER THE ELECTRONIC DEVICE AND THE SUPPORT SUBSTRATE. THE COVER INCLUDES AN INTERCONNECT STRUCTURE (141, 441, 541) ELECTRICALLY COUPLED TO THE ELECTRONIC DEVICE AND ADAPTED TO ELECTRICALLY COUPLE TOGETHER THE ELECTRONIC DEVICE AND THE CIRCUIT FOR PROVIDING IMPEDANCE TRANFORMATION OF AN ELECTRICAL SIGNAL BETWEEN THE ELECTRONIC DEVICE AND THE CIRCUIT.(FIG 1)