ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD

AN ADHESIVE FOR ELECTROLESS PLATING IS FORMED BY DISPERSING CURED HEAT-RESISTANT RESIN PARTICLES SOLUBLE IN ACID OR OXIDIZING AGENT INTO UNCURED HEAT-RESISTANT RESIN MATRIX HARDLY SOLUBLE IN ACID OR OXIDIZING AGENT THROUGH CURING TREATMENT, IN WHICH THE HEAT-RESISTANT RESIN PARTICLES HAVE AN AVERAGE...

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1. Verfasser:	MOTOO ASAI
Format:	Patent
Sprache:	eng
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creator	MOTOO ASAI
description	AN ADHESIVE FOR ELECTROLESS PLATING IS FORMED BY DISPERSING CURED HEAT-RESISTANT RESIN PARTICLES SOLUBLE IN ACID OR OXIDIZING AGENT INTO UNCURED HEAT-RESISTANT RESIN MATRIX HARDLY SOLUBLE IN ACID OR OXIDIZING AGENT THROUGH CURING TREATMENT, IN WHICH THE HEAT-RESISTANT RESIN PARTICLES HAVE AN AVERAGE PARTICLE SIZE OF NOT MORE THAN 1.5 µM.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_MY129871A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>MY129871A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_MY129871A3</originalsourceid><addsrcrecordid>eNrjZGhwdPFwDfYMc1Vw8w9ScPVxdQ4J8vdxDQ5WCPBxDPH0c9dRcHN1dQkO8Xf2VnD29w3wD_YM8fT3AysPCHINcAwCKlIgbIqjnwtQvadfiKuLQrgnWJOTv2OQCw8Da1piTnEqL5TmZpBzcw1x9tBNLciPTy0uSExOzUstifeNNDSytDA3dDQmqAAALYs7Pw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD</title><source>esp@cenet</source><creator>MOTOO ASAI</creator><creatorcontrib>MOTOO ASAI</creatorcontrib><description>AN ADHESIVE FOR ELECTROLESS PLATING IS FORMED BY DISPERSING CURED HEAT-RESISTANT RESIN PARTICLES SOLUBLE IN ACID OR OXIDIZING AGENT INTO UNCURED HEAT-RESISTANT RESIN MATRIX HARDLY SOLUBLE IN ACID OR OXIDIZING AGENT THROUGH CURING TREATMENT, IN WHICH THE HEAT-RESISTANT RESIN PARTICLES HAVE AN AVERAGE PARTICLE SIZE OF NOT MORE THAN 1.5 µM.</description><language>eng</language><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070531&DB=EPODOC&CC=MY&NR=129871A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070531&DB=EPODOC&CC=MY&NR=129871A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOTOO ASAI</creatorcontrib><title>ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD</title><description>AN ADHESIVE FOR ELECTROLESS PLATING IS FORMED BY DISPERSING CURED HEAT-RESISTANT RESIN PARTICLES SOLUBLE IN ACID OR OXIDIZING AGENT INTO UNCURED HEAT-RESISTANT RESIN MATRIX HARDLY SOLUBLE IN ACID OR OXIDIZING AGENT THROUGH CURING TREATMENT, IN WHICH THE HEAT-RESISTANT RESIN PARTICLES HAVE AN AVERAGE PARTICLE SIZE OF NOT MORE THAN 1.5 µM.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGhwdPFwDfYMc1Vw8w9ScPVxdQ4J8vdxDQ5WCPBxDPH0c9dRcHN1dQkO8Xf2VnD29w3wD_YM8fT3AysPCHINcAwCKlIgbIqjnwtQvadfiKuLQrgnWJOTv2OQCw8Da1piTnEqL5TmZpBzcw1x9tBNLciPTy0uSExOzUstifeNNDSytDA3dDQmqAAALYs7Pw</recordid><startdate>20070531</startdate><enddate>20070531</enddate><creator>MOTOO ASAI</creator><scope>EVB</scope></search><sort><creationdate>20070531</creationdate><title>ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD</title><author>MOTOO ASAI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_MY129871A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>online_resources</toplevel><creatorcontrib>MOTOO ASAI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOTOO ASAI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD</title><date>2007-05-31</date><risdate>2007</risdate><abstract>AN ADHESIVE FOR ELECTROLESS PLATING IS FORMED BY DISPERSING CURED HEAT-RESISTANT RESIN PARTICLES SOLUBLE IN ACID OR OXIDIZING AGENT INTO UNCURED HEAT-RESISTANT RESIN MATRIX HARDLY SOLUBLE IN ACID OR OXIDIZING AGENT THROUGH CURING TREATMENT, IN WHICH THE HEAT-RESISTANT RESIN PARTICLES HAVE AN AVERAGE PARTICLE SIZE OF NOT MORE THAN 1.5 µM.</abstract><oa>free_for_read</oa></addata></record>
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title	ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T18%3A10%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MOTOO%20ASAI&rft.date=2007-05-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EMY129871A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true