ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD
AN ADHESIVE FOR ELECTROLESS PLATING IS FORMED BY DISPERSING CURED HEAT-RESISTANT RESIN PARTICLES SOLUBLE IN ACID OR OXIDIZING AGENT INTO UNCURED HEAT-RESISTANT RESIN MATRIX HARDLY SOLUBLE IN ACID OR OXIDIZING AGENT THROUGH CURING TREATMENT, IN WHICH THE HEAT-RESISTANT RESIN PARTICLES HAVE AN AVERAGE...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | AN ADHESIVE FOR ELECTROLESS PLATING IS FORMED BY DISPERSING CURED HEAT-RESISTANT RESIN PARTICLES SOLUBLE IN ACID OR OXIDIZING AGENT INTO UNCURED HEAT-RESISTANT RESIN MATRIX HARDLY SOLUBLE IN ACID OR OXIDIZING AGENT THROUGH CURING TREATMENT, IN WHICH THE HEAT-RESISTANT RESIN PARTICLES HAVE AN AVERAGE PARTICLE SIZE OF NOT MORE THAN 1.5 µM. |
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