INTEGRATED CORE MICROELECTRONIC PACKAGE

INTEGRATED CORE MICROELECTRONIC PACKAGE

A MICROELECTRONIC PACKAGE INLCUDING A MICROELECTRONIC DIE DISPOSED WITHIN AN OPENING IN A MICROELECTRONIC PACKAGING CORE,WHEREIN AN ENCAPSULATION MATERIAL IS DISPOSED WITHIN PORTIONS OF THE OPENING NOT OCCUPIED BY THE MICROELECTRONIC DIE.BUILD-UP LAYERS OF DIELECTRIC MATERIALS AND CONDUCTIVE TRACES...

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Bibliographische Detailangaben
Hauptverfasser: MA, QING, MU, XIAOUN, LI, JIAN, VU, QUAT T, HENAO, MARIA V
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A MICROELECTRONIC PACKAGE INLCUDING A MICROELECTRONIC DIE DISPOSED WITHIN AN OPENING IN A MICROELECTRONIC PACKAGING CORE,WHEREIN AN ENCAPSULATION MATERIAL IS DISPOSED WITHIN PORTIONS OF THE OPENING NOT OCCUPIED BY THE MICROELECTRONIC DIE.BUILD-UP LAYERS OF DIELECTRIC MATERIALS AND CONDUCTIVE TRACES ARE THEN FABRICATED ON THE MICROELECTRONIC DIE,THE ENCAPSULANT MATERIAL,AND THE MICROELECTRONIC PACKAGE CORE TO FROM THE MICROELECTRONIC PACKAGE.