LAYERED PRODUCT, CAPACITOR, ELECTRONIC COMPONENT AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME

LAYERED PRODUCT, CAPACITOR, ELECTRONIC COMPONENT AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME

RESIN THIN FILMS (12) AND METAL THIN FILMS (11A, 11B) ARE LAYERED IN ALTERNATION.THE METAL THIN FILMS ARE SET BACK FROM THE PERIPHERAL EDGES OF THE RESIN THIN FILMS (12). VIA HOLES (13A,13B) PENETRATING THE LAYERED PRODUCT IN THE LAYERING DIRECTION ARE FORMED AND FILLED WITH CONDUCTIVE MATERIAL (14A...

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Bibliographische Detailangaben
Hauptverfasser: KAZUYOSHI HONDA, YOSHIAKI KAI, MASARU ODAGIRI, NORIYASU ECHIGO, NOBUKI SUNAGARE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:RESIN THIN FILMS (12) AND METAL THIN FILMS (11A, 11B) ARE LAYERED IN ALTERNATION.THE METAL THIN FILMS ARE SET BACK FROM THE PERIPHERAL EDGES OF THE RESIN THIN FILMS (12). VIA HOLES (13A,13B) PENETRATING THE LAYERED PRODUCT IN THE LAYERING DIRECTION ARE FORMED AND FILLED WITH CONDUCTIVE MATERIAL (14A, 14B). THE CONDUCTIVE MATERIAL (14A, 14B) ELECTRICALLY CONNECTS THE METAL THIN FILMS (11A, 11B) AMONG ONE ANOTHER. THE METAL THIN FILMS ARE NOT EXPOSED AT THE PERIPHERY, SO THAT CORROSION OF THE METAL THIN FILMS IS NOT LIKELY TO OCCUR. FURTHERMORE, CUTTING OF THE METAL THIN FILMS DURING THE MANUFACTURING PROCESS IS AVOIDED.(FIG 1D,1E)