SEMICONDUCTOR DEVICE, ITS FABRICATION METHOD AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, ITS FABRICATION METHOD AND ELECTRONIC DEVICE

A SEMICONDUCTOR DEVICE (10) COMPRISES: A SEMICONDUCTOR CHIP (1) HAVING A CIRCUIT FABRICATION SURFACE (1X) AND AN ELECTRODE (1C);A RESIN (7) FOR COVERING THE CIRCUIT FABRICATION SURFACE (1X) OF THE SEMICONDUCTOR CHIP (1);AND A RESIN FILM (2) FOR COVERING A REAR SURFACE (1Y) FACING THE CIRCUIT FABRICA...

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Hauptverfasser: HIDEKI TANAKA, TOMOAKI KUDAISHI, SEIICHI ICHIHARA, YUTAKA NAKAJIMA, MASAKO SASAKI, KUNIHIKO NISHI, KAZUNARI SUZUKI, HISAO NAKAMURA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:A SEMICONDUCTOR DEVICE (10) COMPRISES: A SEMICONDUCTOR CHIP (1) HAVING A CIRCUIT FABRICATION SURFACE (1X) AND AN ELECTRODE (1C);A RESIN (7) FOR COVERING THE CIRCUIT FABRICATION SURFACE (1X) OF THE SEMICONDUCTOR CHIP (1);AND A RESIN FILM (2) FOR COVERING A REAR SURFACE (1Y) FACING THE CIRCUIT FABRICATION SURFACE (1X) OF THE SEMICONDUCTOR CHIP (1).WITH THE CONFIGURATION DESCRIBED ABOVE, A CRACK CAN BE PREVENTED FROM BEING GENERATED IN THE SEMICONDUCTOR CHIP (1).(FIG.1)