METHOD OF PURIFYING ALKALINE SOLUTION AND METHOD OF ETCHING SEMICONDUCTOR WAFERS

A METHOD OF PURIFYING AN ALKALINE SOLUTION IS CAPABLE OF EXTREMELY EFFICIENTLY NONIONIZING METALLIC IMPURITY IONS IN AN ALKALINE SOLUTION AT A LOW COST. A METHOD OF ETCHING SEMICONDUCTOR WAFERS IN TURN IS CAPABLE OF ETCHING SEMICONDUCTOR WAFERS USING THE PURIFIED ALKALINE SOLUTION WITHOUT DETERIORAT...

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Hauptverfasser:	HIROYUKI TAKAMATSU, TOSHI AJITO, ISAO UCHIYAMA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOUNDS OF ALKALI METALS, i.e. LITHIUM, SODIUM, POTASSIUM,RUBIDIUM, CAESIUM, OR FRANCIUM DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INORGANIC CHEMISTRY METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SEMICONDUCTOR DEVICES TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
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Zusammenfassung:	A METHOD OF PURIFYING AN ALKALINE SOLUTION IS CAPABLE OF EXTREMELY EFFICIENTLY NONIONIZING METALLIC IMPURITY IONS IN AN ALKALINE SOLUTION AT A LOW COST. A METHOD OF ETCHING SEMICONDUCTOR WAFERS IN TURN IS CAPABLE OF ETCHING SEMICONDUCTOR WAFERS USING THE PURIFIED ALKALINE SOLUTION WITHOUT DETERIORATING THE QUALITY OF THE SEMICONDUCTOR WAFERS. A REDUCING AGENT HAVING AN OXIDATION POTENTIAL LOWER THAN A REVERSIBLE ELECTRODE POTENTIAL OF METALLIC IONS EXISTING IN THE ALKALINE SOLUTION IS DISSOLVED IN THE ALKALINE SOLUTION TO THEREBY NONIOZINE THE METALLIC IONS EXISTING IN THE ALKALINE SOLUTION.(FIG. 1)