POLYBENZOXAZOLE RESIN AND PRECURSOR THEREOF

THE PRESENT INVENTION PROVIDES HEAT RESISTANT RESINS EXCELLENT IN ALL OF THERMAL CHARACTERISTICS, ELECTRICAL CHARACTERISTICS, PHYSICAL CHARACTERISTICS AND MECHANICAL CHARACTERISTICS IN USE FOR SEMICONDUCTORS. THAT IS, THE PRESENT INVENTION PROVIDES POLYBENZOXAZOLE PRECURSORS REPRESENTED BY THE FOLLO...

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Hauptverfasser: TSUYOSHI WATANABE, HIDENORI SAITO, MAKI TOKUHIRO, MICHIO NAKAJIMA
Format: Patent
Sprache:eng
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Zusammenfassung:THE PRESENT INVENTION PROVIDES HEAT RESISTANT RESINS EXCELLENT IN ALL OF THERMAL CHARACTERISTICS, ELECTRICAL CHARACTERISTICS, PHYSICAL CHARACTERISTICS AND MECHANICAL CHARACTERISTICS IN USE FOR SEMICONDUCTORS. THAT IS, THE PRESENT INVENTION PROVIDES POLYBENZOXAZOLE PRECURSORS REPRESENTED BY THE FOLLOWING GENERAL FORMULA (A) AND POLYBENZOXAZOLE RESINS REPRESENTED BY THE FOLLOWING GENERAL FORMULA (D).IN THE ABOVE FORMULAS (A) AND (D), N DENOTES AN INTEGER OF 2-1000 AND X DENOTES A STRUCTURE SELECTED FROM THOSE REPRESENTED BY THE FOLLOWING FORMULAS (B):.IN THE ABOVE FORMULAS (B), Y DENOTES A STRUCTURE SELECTED FROM THOSE REPRESENTED BY THE FOLLOWING FORMULAS (C) , AND THE HYDROGEN ATOM (S) ON THE BENZENE RING IN THESE STRUCTURES MAY BE SUBSTITUTED WITH AT LEAST ONE GROUP SELECTED FROM THE GROUP CONSISTING OF METHYL GROUP, ETHYL GROUP, PROPYL GROUP, ISOPROPYL GROUP, BUTYL GROUP, ISOBUTYL GROUP, T-BUTYL GROUP, FLUORINE ATOM AND TRIFLUOROMETHYL GROUP: