CHIP CARRIER WITH PROTECTIVE COATING FOR CIRCUITIZED SURFACE

A CHIP CARRIER IS DISCLOSED WHICH INCLUDES A CHIP CARRIER SUBSTRATE AND AT LEAST ONE SEMICONDUCTOR CHIP MOUNTED IN A FLIP CHIP CONFIGURATION, VIA SOLDER BALLS, ON A CIRCUITIZED SURFACE OF THE CHIP CARRIER SUBSTRATE. THE SOLDER BALLS ARE ENCAPSULATED IN A FIRST ENCAPSULANT HAVING A COMPOSITION WHICH...

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Bibliographische Detailangaben
Hauptverfasser:	JAMES WARREN WILSON, ALAN WALTER CHASE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A CHIP CARRIER IS DISCLOSED WHICH INCLUDES A CHIP CARRIER SUBSTRATE AND AT LEAST ONE SEMICONDUCTOR CHIP MOUNTED IN A FLIP CHIP CONFIGURATION, VIA SOLDER BALLS, ON A CIRCUITIZED SURFACE OF THE CHIP CARRIER SUBSTRATE. THE SOLDER BALLS ARE ENCAPSULATED IN A FIRST ENCAPSULANT HAVING A COMPOSITION WHICH INCLUDES AN EPOXY. IN ADDITION, AT LEAST A PORTION OF THE CIRCUITRY ON THE CIRCUITIZED SURFACE IS ENCAPSULATED IN A SECOND ENCAPSULANT HAVING A COMPOSITION WHICH INCLUDES A URETHANE, AND WHICH COMPOSITION IS CHOSEN SO THAT THE SECOND ENCAPSULANT EXHIBITS A MODULUS OF ELASTICITY WHICH IS EQUAL TO OR LESS THAN ABOUT 10,000 PSI. AS A CONSEQUENCE, THE SECOND ENCAPSULANT EXHIBITS NEITHER INTERNAL CRACKS, NOR INTERFACIAL CRACKS AT THE INTERFACE WITH THE FIRST ENCAPSULANT, NOR DOES THE SECOND ENCAPSULANT DELAMINATE FROM THE CIRCUITIZED SURFACE, WHEN THE CHIP CARRIER IS THERMALLY CYCLED.FIG. 1