SUPPLY PIN REARRANGEMENT FOR AN I.C

SUPPLY PIN REARRANGEMENT FOR AN I.C

AN IC IS PROVIDED WITH SUPPLY PINS EXTENDING BEYOND THE CHIP''S ENCAPSULATION. THE LOCATION OF THE SUPPLY PINS IS CHOSEN SO AS TO MINIMIZE THE LENGTH OF THE ASSOCIATED BONDING WIRES. MOREOVER THE SUPPLY PINS ARE LOCATED NEXT TO EACH OTHER SO AS TO REDUCE THE EFFECTIVE INDUCTANCE OF THE ASS...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ROELOF HERMAN WILLEM SALTERS
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Beschreibung
Zusammenfassung:AN IC IS PROVIDED WITH SUPPLY PINS EXTENDING BEYOND THE CHIP''S ENCAPSULATION. THE LOCATION OF THE SUPPLY PINS IS CHOSEN SO AS TO MINIMIZE THE LENGTH OF THE ASSOCIATED BONDING WIRES. MOREOVER THE SUPPLY PINS ARE LOCATED NEXT TO EACH OTHER SO AS TO REDUCE THE EFFECTIVE INDUCTANCE OF THE ASSOCIATED BONDING WIRES. OUTPUT PINS CONNECTED WITH ON-CHIP BUFFERS ARE LOCATED NEXT TO THE SUPPLY PINS SO AS TO REDUCE THE LENGTH OF THE BUFFER'S SUPPLY LINES, GIVING RISE TO A FURTHER REDUCTION IN INDUCTIVE PARASITIC EFFECTS. BEYOND THE OUTPUT PINS CONTROL PINS IS PROVIDED TO BE USED IN FOR INSTANCE MEMORY I.C.'S HAVING VARIOUS LAY-OUTS. (FIG. 2)