HIGH TEMPERATURE PAPER CONTAINING ARAMID COMPONENT

Provided is a paper structure comprised of cellulose pulp fiber, a polymeric binder, and an aramid component comprised of aramid fiber and/or fibrid. The paper structure can also comprise multiple layers of different composition, but at least one layer must comprise the aramid component and polymeri...

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Bibliographische Detailangaben
1. Verfasser:	KINSLEY, HOMAN, B., JR
Format:	Patent
Sprache:	eng ; spa
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY IMPREGNATING OR COATING OF PAPER INSULATORS PAPER NOT OTHERWISE PROVIDED FOR PAPER-MAKING PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D PRODUCTION OF CELLULOSE PULP COMPOSITIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TEXTILES TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G
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Beschreibung
Zusammenfassung:	Provided is a paper structure comprised of cellulose pulp fiber, a polymeric binder, and an aramid component comprised of aramid fiber and/or fibrid. The paper structure can also comprise multiple layers of different composition, but at least one layer must comprise the aramid component and polymeric binder. Se proporciona una estructura de papel que comprende fibra de pulpa de celulosa, un aglutinante polimerico y un componente de aramida que comprende fibra y/o fibrida de aramida. La estructura de papel puede tambien comprender multiples capas de composicion diferente, pero por lo menos una capa debe comprender el componente de aramida y aglutinante polimerico.