METHOD OF APPLYING A CURABLE RESIN TO A SUBSTRATE FOR USE IN PAPERMAKING
The invention comprises a method for applying a curable resin, such as a photosensitive resin, to a substrate such as a papermaker's dewatering felt (220). The method comprises the steps of providing a substrate; providing a curable liquid resin; providing a second material different from the c...
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Format: | Patent |
Sprache: | eng ; spa |
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Zusammenfassung: | The invention comprises a method for applying a curable resin, such as a photosensitive resin, to a substrate such as a papermaker's dewatering felt (220). The method comprises the steps of providing a substrate; providing a curable liquid resin; providing a second material different from the curable liquid resin; applying the second material (2410) to the substrate to occupy at least some of the voids in the substrate intermediate the first (230) and second (232) surfaces of the substrate; applying the curable resin (1520) to the substrate; curing (3150) at least some of the resin to provide a resin layer on the substrate; and removing (3170, 2550) at least some of the second material from the substrate, wherein at least some of the second material is removed from the substrate after applying the curable resin to the substrate.
La invencion comprende un método para aplicar una resina curable, tal como una resina fotosensible, a un substrato tal como un fieltro de desagüe para hacer papel (220). El método comprende los pasos de proveer un substrato; proveer una resina líquida curable; proveer un segundo material diferente a la resina líquida curable; aplicar el segundo material (2410) al substrato para ocupar por lo menos algo de los huecos en el substrato intermedios a las primeras (230) y segunda (232) superficies del substrato; aplicar la resina curable (1520) al substrato; curar (3150) por lo menos algo de la resina para proveer una capa de resina sobre el substrato; y remover (3170, 2550) por lo menos algo del segundo material del substrato, en donde por lo menos algo del segundo material se remueve del substrato después de aplicar la resina curable al substrato. |
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