LOW VISCOSITY THERMALLY CONDUCTIVE PASTE

The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH)3) as a filler for Thermal Interface Materials (TIM). La invención se basa en el uso novedoso de trihidróxido de aluminio (ATH o Al(OH)3) como relleno para Materiales de Interfaz Térmica (TIM).

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Bibliographische Detailangaben
Hauptverfasser:	KONG Stanley Shengqian, AHEARN Matthew
Format:	Patent
Sprache:	eng ; spa
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH)3) as a filler for Thermal Interface Materials (TIM). La invención se basa en el uso novedoso de trihidróxido de aluminio (ATH o Al(OH)3) como relleno para Materiales de Interfaz Térmica (TIM).