POLYAMIDE COMPOSITION AND THE ARTICLE THEREOF

The present invention disclosed to a polyamide composition, and an article which is ob- tained or obtainable from the polyamide composition, especially the connector socket for Double Data Rate (5) RAM. The polyamide composition of the present invention shows de- sirable tensile strength for the art...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHUANG Fu Chin, LU Wen, PARAPPUVEETIL SARANGADHARAN Suresh, CHEN Lin
Format:	Patent
Sprache:	eng ; spa
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention disclosed to a polyamide composition, and an article which is ob- tained or obtainable from the polyamide composition, especially the connector socket for Double Data Rate (5) RAM. The polyamide composition of the present invention shows de- sirable tensile strength for the article with thin thickness of 0.4 mm, well flowability, high HDT which make it could be applied in electronic component with high work frequency. Mean- while, the composition also exhibits good thermal stability during molding, and approaches UL 94 V-0. La presente invención divulga una composición de poliamida y un artículo que se obtiene o se puede obtener de la composición de poliamida, especialmente el enchufe conector para doble velocidad de datos (5) RAM. La composición de poliamida de la presente invención muestra una resistencia a la tracción conveniente para el artículo con un espesor fino de 0.4 mm, buena fluidez, alta HDT, que podría aplicarse en un componente electrónico con alta frecuencia de funcionamiento. A la vez, la composición también exhibe buena estabilidad térmica durante el moldeo y se acerca a UL 94 V-0.