THIOL-CONTAINING COMPOSITION

The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods. La presente invención se refiere a una composición...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAKAJIMA Masayuki, RAYER Baptiste, VOTRUBA-DRZAL Peter L, CONDIE Allison G, TAN Kar Tean, ZHOU Hongying, FRENCH Maria S
Format:	Patent
Sprache:	eng ; spa
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods. La presente invención se refiere a una composición que comprende: un compuesto de epoxi, un agente de curado de politiol y un segundo agente de curado; también se divulgan métodos para tratar un sustrato con la composición y sustratos formados con tales métodos.