DEVICE AND METHOD FOR VAPOR PHYSICAL DEPOSITION WITH HIGH POWER PULSES USING ALTERNATE TARGETS

The present disclosure is related to a device for the physical vapor deposition using high power pulses in determinate periods of time measured in microseconds. Unlike the cited precedent, in the device described in this document, two targets are simultaneously used as vapor emitters; in contrast to the precedent, in this development the piece is presented, for a selected period, in a rotation and translation movement, in front of the vapor emission of each target. As in the precedent above cited, the process is produced by the interaction of functional groups, which are also described in the context of the present document; the functional groups are identified as systems. The evolution of the parameters of each system as well as its control is performed through communication protocols through serial ports. The physical vapor deposition occurs in a chamber in which a vacuum is produced by the proper interaction of each one of the systems. The interaction of the following systems is de scribed in the document: I. Gas supply and extraction system. II. Power supply system III. Registration and control system. In addition to the above-mentioned precedent, the present document provides ways of entering a gas mixture in the chamber using as a resource the plasma luminous emission affected by means of a valve whose control is performed in a dynamic way, having as reference, the information generated in the same process. Likewise, the production of high power pulses may be complemented by additional voltages over the parts to be coated. The document details the elements that constitute each system as well as the interaction modes between them. The development described in this document corresponds to a larger volume than the cited precedent; on the other hand, ways of entering a gas mixture into the chamber using information generated in the plasma with the light emission are also described. Furthermore, a device is provided for measuring the partial pressure of oxygen in the chamber, thereby avoiding the formation of hysteresis cycles during the reactive mode operation of the device. Likewise, special and original elements are considered for the thin films production for the parts coating, the films may be multicomponent; the formed film structure may be of a micro or a nano size. The generated films may have diverse functional applications; the developments to build high performance tribological systems have been oriented to have low friction and wear coefficien