HOTMELT ADHESIVE WITH IMPROVED ADHESION
The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/C 4 to C 20 alpha-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on C 2 to C 5...
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Format: | Patent |
Sprache: | eng ; spa |
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Zusammenfassung: | The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/C 4 to C 20 alpha-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on C 2 to C 5 olefins with (meth)acrylic esters of low molecular mass alkanols, the copolymer containing COOH groups or anhydride groups, and also, if desired, on wax and additives, and to its use for bonding finished substrate surfaces.
La presente invención se refiere a un adhesivo termofusible basado en por lo menos un copolímero de etileno y/o propileno/a-olefina C4 a C20 que puede obtenerse mediante polimerización catalizada por metaloceno, en por lo menos una resina pegajosa y en por lo menos de 0.1% a 15% en peso de un copolímero o terpolímero basado en olefinas C2 a C5 con ésteres (met) acrílicos de alcanoles de baja masa molecular, el copolímero contiene grupos COOH o grupos anhídrido y también, si se desea, en cera y aditivos, y al uso de dicho adhesivo para unir superficies de sustrato terminadas. |
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