SYSTEMS, DEVICES, AND METHODS FOR INCREASING CURRENT CARRYING CAPACITY

Certain exemplary embodiments can comprise a system, which can comprise basepan (2000) comprising a banding stud (2500, 2600). The banding stud can be configured to releasably attach a heat sink (2300, 2800) to the basepan. The heat sink configured to increase a current carrying capacity of a system...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FAN ZHANG, ROBERT E. HENRY
Format:	Patent
Sprache:	eng ; spa
Schlagworte:	BOARDS, SUBSTATIONS, OR SWITCHING ARRANGEMENTS FOR THE SUPPLYOR DISTRIBUTION OF ELECTRIC POWER CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Certain exemplary embodiments can comprise a system, which can comprise basepan (2000) comprising a banding stud (2500, 2600). The banding stud can be configured to releasably attach a heat sink (2300, 2800) to the basepan. The heat sink configured to increase a current carrying capacity of a system associated with the basepan from a first predetermined level to a second predetermined level. Ciertas modalidades ejemplares pueden comprender un sistema, el cual comprende una bandeja base (2000) que comprende una clavija de enclavamiento (2500,2600). La clavija de enclavamiento se puede configurar para acoplar de forma liberable un disipador de calor (23000,2800) a la bandeja base. El disipador de calor se configura para incrementar la capacidad de conductividad de corriente de un sistema asociado con la bandeja base desde un primer nivel predeterminado hasta un segundo nivel predeterminado.