DEPOSITION METHOD OF A THIN MULTILAYER DIELECTRIC

Invention relates to a method for fabrication of multilayer thin dielectric. Multilayer dielectric is formated by deposition of several layers of the same chemical composition on top of each other. At least two layers of Si3N4 are deposited on top of each other using chemical vapor deposition method...

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Bibliographische Detailangaben
Hauptverfasser:	DEHTJARS, Jurijs, ROMANOVA, Marina, AVOTIŅA, Līga, JEŅIČEKS, Genādijs, ZASLAVSKIS, Aleksandrs
Format:	Patent
Sprache:	eng ; lav
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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