ONE-COMPONENT EPOXY ADHESIVE FOR BONDING STRUCTURAL MATERIALS

The invention relates to epoxy adhesive for bonding construction materials, which includes a thermoplastic filler, having increased fracture toughness. The technical problem solved by the proposed invention is to increase the fracture toughness of epoxy adhesive after hardening. One-component epoxy...

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Bibliographische Detailangaben
Hauptverfasser:	BIKOVENS OSKARS, BLUMBERGS ILMĀRS, ARNAUTOVS ALEKSANDRS, HAUKA MĀRIS, NASIBULLINS ALEKSEJS, GRIBNIAK VIKTOR
Format:	Patent
Sprache:	eng ; lav
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to epoxy adhesive for bonding construction materials, which includes a thermoplastic filler, having increased fracture toughness. The technical problem solved by the proposed invention is to increase the fracture toughness of epoxy adhesive after hardening. One-component epoxy adhesive for bonding structural materials contains components in the following proportions, in parts by weight: bisphenol A epoxy resin: 100; filler - polyethersulfone with particle size