COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD

There is provided a copper foil with a carrier capable of significantly reducing the generation of blisters caused by hot pressing for stacking to a resin substrate. The copper foil with a carrier includes, in sequence, a carrier, a release layer and an extremely thin copper foil. The release layer...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIDA Takuma, HOSOKAWA Makoto, TAKANASHI Akitoshi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	There is provided a copper foil with a carrier capable of significantly reducing the generation of blisters caused by hot pressing for stacking to a resin substrate. The copper foil with a carrier includes, in sequence, a carrier, a release layer and an extremely thin copper foil. The release layer comprises a carboxyl group-containing compound and a derivative thereof. The number of H2O molecules per unit area in the copper foil with a carrier is 3.44x10¹6/cm² or less, and the number of CO2 molecules per unit area in the copper foil with a carrier is 1.39x10¹6/cm² or less.