METHOD FOR DETERMINING THE LAYER THICKNESS OF A CONNECTING LAYER BETWEEN TWO PACKAGING LAYERS

METHOD FOR DETERMINING THE LAYER THICKNESS OF A CONNECTING LAYER BETWEEN TWO PACKAGING LAYERS

For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is determined in advance, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZAMIRI, Saeid, KORNFELD, Martin, REITINGER, Bernhard, GRÜNSTEIDL, Clemens, ROITHER, Jürgen, WEGENBERGER, Alfred
Format: Patent
Sprache:eng ; lit
Schlagworte:
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is determined in advance, and a maximum (M1, M2, Mn) in the measurement signal (S) is sought, and the point in time of occurrence of this maximum (M1, M2, Mn) is determined as the total transit time (T1, T2, Tn) of the ultrasonic wave, and the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is subtracted from the total transit time (T1, T2, Tn), and the thickness (d) of the bonding layer is deduced from the known ultrasonic speed (vS) in the bonding layer (5).