FLOORING ASSEMBLY WITH HEAT DISSIPATION LAYER

A composite, heat dissipating panel for a compartment includes a panel made up of a first skin, a second skin positioned below the first skin, and a core encapsulated within the panel between the first and second skins and peripheral closeouts. A heat dissipation layer is provided in the panel at or...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BIDDLE, Andrew J, DESING, James E
Format:	Patent
Sprache:	eng ; lit
Schlagworte:	BODY DETAILS OR KINDS OF RAILWAY VEHICLES BUILDING BUILDING MATERIALS CEILINGS FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INSULATION OR OTHER PROTECTION OF BUILDINGS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS RAILWAYS ROOFS STRUCTURAL ELEMENTS TRANSPORTING WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:	A composite, heat dissipating panel for a compartment includes a panel made up of a first skin, a second skin positioned below the first skin, and a core encapsulated within the panel between the first and second skins and peripheral closeouts. A heat dissipation layer is provided in the panel at or above the first skin.