LAMINATING MATERIAL FOR PRINTED CIRCUIT BOARD OF LOW DIELECTRIC CONSTANT

요약 없음. A printed circuit board material composed of a reinforcing base material and a cured or uncured resin is disclosed, in which the base material is a fabric woven from hybrid yarns each of which is prepared from (I-1) at least one multifilament yarn made of glass fiber having a dielectric constant at 1 MHz of not higher than 5.5 or (I-2) at least one multifilament yarn made of heat resistant engineering plastic fiber having a dielectric constant at 1 MHz of not higher than 5.5 and (II) at least one yarn made of fluoroplastic long fiber and the thermosetting resin is a thermosetting resin whose dielectric constant after curing is not higher than 3.7. The material is excellent in dielectric properties and characteristics required for use in printed circuit board, such as heat resistance in soldering, flexural strength and peel strength of copper foil. The material shows substantial constancy of dielectric constant even with change of resin content and is therefore particularly suitable for use in a multilayer printed circuit board.