ADHESIVE COMPOSITIONS

The adhesive compsn. is prepd. by adding and dissolving : a mixture comprising 10-50 wt.% of epoxy resin, 15-35 wt.% of polyamide resin and 5-40 wt.% of phenol resin; 15-35 wt.% of acrylonitrile; and 0.1-4 wt.% of hardening accelerating agent within methanol or mixed solution of methanol and chlorof...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, JONG - KOO, JUNG, YOUN - SUK, AHN, TAE - WAN, YU, YOUNG - CHOOL
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The adhesive compsn. is prepd. by adding and dissolving : a mixture comprising 10-50 wt.% of epoxy resin, 15-35 wt.% of polyamide resin and 5-40 wt.% of phenol resin; 15-35 wt.% of acrylonitrile; and 0.1-4 wt.% of hardening accelerating agent within methanol or mixed solution of methanol and chloroform. Pref. the hardening accelerating agent is benzyl dimethylamine, 2-methyl diimidazole or 2-ethyl-4-phenyl imidazole. The obtd. adhesive compsn. has excellent heat resistance and is useful for preparation of a flexible copper clad laminate.