LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIYAIRI, AKIRA, OKIKAWA, SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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