LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4,...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAIRI, AKIRA, OKIKAWA, SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4, resin 11 is fed into the holes 5 when a package is molded to completely stop moving the lead 4. Thus, the bonding of the lead 4 to the package resin 11 is extremely strengthened. A circular-arc portion 8 is formed at the connecting portion of the tab 3 to the lead 4 to increase the width of the connecting portion. Since the width of the connecting portion is thus wide, the stress can be that much dispersed with the result of effectively preventing a pellet from cracking due to the stress concentration.