LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MIYAIRI, AKIRA, OKIKAWA, SUSUMU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MIYAIRI, AKIRA
OKIKAWA, SUSUMU
description PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4, resin 11 is fed into the holes 5 when a package is molded to completely stop moving the lead 4. Thus, the bonding of the lead 4 to the package resin 11 is extremely strengthened. A circular-arc portion 8 is formed at the connecting portion of the tab 3 to the lead 4 to increase the width of the connecting portion. Since the width of the connecting portion is thus wide, the stress can be that much dispersed with the result of effectively preventing a pellet from cracking due to the stress concentration.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR950000204BB1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR950000204BB1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR950000204BB13</originalsourceid><addsrcrecordid>eNrjZDDycXV0UXALcvR1VXD0c1EIdvX1dPb3cwl1DvEPUnBxDfN0dlUIDfb0c1cI8XBVCAaq42FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BlqYGQGBkYOLkZGhMnCoA4oInVQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME</title><source>esp@cenet</source><creator>MIYAIRI, AKIRA ; OKIKAWA, SUSUMU</creator><creatorcontrib>MIYAIRI, AKIRA ; OKIKAWA, SUSUMU</creatorcontrib><description>PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4, resin 11 is fed into the holes 5 when a package is molded to completely stop moving the lead 4. Thus, the bonding of the lead 4 to the package resin 11 is extremely strengthened. A circular-arc portion 8 is formed at the connecting portion of the tab 3 to the lead 4 to increase the width of the connecting portion. Since the width of the connecting portion is thus wide, the stress can be that much dispersed with the result of effectively preventing a pellet from cracking due to the stress concentration.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19950111&amp;DB=EPODOC&amp;CC=KR&amp;NR=950000204B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19950111&amp;DB=EPODOC&amp;CC=KR&amp;NR=950000204B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAIRI, AKIRA</creatorcontrib><creatorcontrib>OKIKAWA, SUSUMU</creatorcontrib><title>LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME</title><description>PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4, resin 11 is fed into the holes 5 when a package is molded to completely stop moving the lead 4. Thus, the bonding of the lead 4 to the package resin 11 is extremely strengthened. A circular-arc portion 8 is formed at the connecting portion of the tab 3 to the lead 4 to increase the width of the connecting portion. Since the width of the connecting portion is thus wide, the stress can be that much dispersed with the result of effectively preventing a pellet from cracking due to the stress concentration.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDycXV0UXALcvR1VXD0c1EIdvX1dPb3cwl1DvEPUnBxDfN0dlUIDfb0c1cI8XBVCAaq42FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BlqYGQGBkYOLkZGhMnCoA4oInVQ</recordid><startdate>19950111</startdate><enddate>19950111</enddate><creator>MIYAIRI, AKIRA</creator><creator>OKIKAWA, SUSUMU</creator><scope>EVB</scope></search><sort><creationdate>19950111</creationdate><title>LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME</title><author>MIYAIRI, AKIRA ; OKIKAWA, SUSUMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR950000204BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAIRI, AKIRA</creatorcontrib><creatorcontrib>OKIKAWA, SUSUMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAIRI, AKIRA</au><au>OKIKAWA, SUSUMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME</title><date>1995-01-11</date><risdate>1995</risdate><abstract>PURPOSE:To prevent the pellet of a semiconductor device from cracking by using a lead frame in which a stress alleviating portion is formed inside from a locking unit by forming the locking unit in a tab hanging lead. CONSTITUTION:Since through-holes 5 are formed in a tab 3 and a tab handing lead 4, resin 11 is fed into the holes 5 when a package is molded to completely stop moving the lead 4. Thus, the bonding of the lead 4 to the package resin 11 is extremely strengthened. A circular-arc portion 8 is formed at the connecting portion of the tab 3 to the lead 4 to increase the width of the connecting portion. Since the width of the connecting portion is thus wide, the stress can be that much dispersed with the result of effectively preventing a pellet from cracking due to the stress concentration.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_KR950000204BB1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T18%3A40%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MIYAIRI,%20AKIRA&rft.date=1995-01-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR950000204BB1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true